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Failure Analysis Service
Failure Analysis Service Specification
- Display
- Digital reports, microscopic imaging, SEM, EDS
- Material
- Depends on failed component (metal, plastic, electronic, composite, etc.)
- Weight
- Varies as per evaluation requirements
- Frequency
- DC to 5GHz (for signal and electronic analysis)
- Measuring Range
- Micron to nanometer scale analysis capability
- Usage & Applications
- Determining mode, cause and location of failure in mechanical, electrical, and electronic components
- Size
- Component or part dependent; accommodates various sample dimensions
- Voltage
- Applicable for electrical fault analysis, 1V up to 1000V depending on test
- Power
- 110V/220V AC (equipment dependent)
- Temperature
- Analysis can be performed from subzero up to 1200C depending upon test method
- Interface
- Sample submission via lab portal or direct delivery
- Driven Type
- Manual and automated analytical instruments
- Report Format
- Detailed digital and printed documentation with root cause explanation and photomicrographs
- Industries Served
- Automotive, aerospace, construction, electronics, energy, heavy industry
- Data Delivery
- Secured email, cloud access or hard copy by request
- Sample Types
- Metals, polymers, ceramics, composites, electronics
- Turnaround Time
- Typically 514 business days, urgent services available
- Service Mode
- Onsite sample collection or offsite laboratory analysis
- Support
- Expert technical consultancy and after-report review
- Analysis Methods
- SEM, EDX, FTIR, XRD, Microhardness, Metallography
- Test Standards
- ASTM, ISO standards followed as required
- Expertise
- Failure of welds, fasteners, PCBs, connectors, coatings, microcracks, and more



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